The kind of lapping plate Insaco uses plays a vital role in the lapping process. It significantly affects the output of this abrasive machining technique. A plate should not be too hard as it damages ...

Abstract: In response to the lack of on-line monitoring of process stability in the traditional lapping process, the limit device of the workpiece was retrofitted to reflect the process stability in ...

Lapping is a finishing process where loose abrasive grains contained in a slurry are pressed against a workpiece to reduce its surface roughness. To perform a lapping operation, the user needs to set ...

The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...

Lapping is a final abrasive finishing operation that produces extreme dimensional accuracy, corrects minor imperfections of shape, refines surface finish and produces close fit between mating surfaces ...

Lapping is one of the standard essential methods to realise the global planarization of SiC and other semiconductor substrates. It is necessary to deeply study the mechanism to obtain SiC lapping ...

Logitech describes key advantages of its new LP70 multi-station automated lapping and polishing system that can dramatically increase overall wafer productivity by 40 percent for almost all substrate ...

The lapping and polishing of wafers used to manufacture semiconductors and optical devices is a time consuming task that can risk damage to expensive custom wafers worth in excess of (USD) $5,000 each ...