As electronic content in vehicles continues to rise, designers must find solutions for reliability under intense heat, advises Daren McClearnon. Heat kills semiconductors and automotive environments ...

How in-house-developed and third-party general-purpose simulation tools are limited to a few expert users and aren’t easily shareable. How multiphysics simulation of subsystems can result in an ...

The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...

Siemens Digital Industries Software is adopting a new approach for sharing accurate thermal models of IC packages to the electronics supply chain. The main advantages are protecting IP, enhancing ...

Power electronics design is a critical aspect of modern engineering, influencing the efficiency, reliability, and performance of numerous applications. Developing circuits that meet stringent ...

Written by Dr. Pradyumna (Prady) Gupta, Founder & CEO of Infinita Lab and Infinita Materials. As electronic devices and EV systems continue to push the boundaries of power density and miniaturization, ...

The term ‘bandgap’ refers to the energy difference between a material’s insulating and conducting states, a critical factor determining its electrical conductivity. As shown in figure 1, with its wide ...

For the PDF version of this feature, click here. In most modern power semiconductor applications there is a need to carefully manage heat. This is true in fields as diverse as mobile communications, ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...