Thanks to advances in circuit miniaturization and systemin- package (SiP) technology, the goals of smaller size and more functionality have become attainable. Thanks to advances in circuit ...

RF SiP technology is an enabling packaging platform for wireless communication, which is constrained by the fact that, today, SiP design is an “expert engineering” process—one that is not scalable as ...

Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

The solution comes in the form of a change in the design methodology for SiP products. A co-design environment that accommodates the RFIC flow and links this schematic-based flow to package ...