Semiconductor Engineering sat down to discuss the myriad challenges associated with chips used in complex systems over longer periods of time them with Jean-Marie Brunet, senior director for the ...
In IC physical design, there is a tendency to focus on the synthesis and layout tasks, and to not give much consideration to the chip finishing tasks, at least not until the more pressing matters of ...
The lead ship of the USN's guided-missile programme is facing construction issues and delivery delays. (US Navy) Design instability has created construction problems for the new US Navy (USN) ...
The modern ASIC consists of millions of gates and billions of transistors that often can be operating in several domains having different voltages and clock frequencies. To avoid data loss, designers ...
Activity surrounding the 5nm manufacturing process node is quickly ramping, creating a better picture of the myriad and increasingly complex design issues that must be overcome. Progress at each new ...
Beyond “Lead-Free”: An Update on the IPC-1752A Standard for Materials Declaration With substance restrictions on the rise, the IPC-1752A Materials Declaration Management Standard helps streamline the ...
In VLSI layout design, density issues are critical factors influencing the performance, yield, and reliability of integrated circuits. This whitepaper delves into the several types of density issues, ...
It doesn't matter if you're the logic designer, hardware engineer, or systems engineer, or if you wear all of those hats. If you use an FPGA in any sort of complex system with high speeds and multiple ...
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